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AMDCOMPUTEX2021， Lisa Su博士宣布了另一项振奋人心的技术——AMD将Chiplet封装技术与芯片堆叠技术相结合，为未来的高性能计算产品创造出了3D Chiplet架构，这项技术首先将应用于实现“3D垂直缓存”详细微博@Jackeychen_ 公众号jackeychenTV
【数码小杰】2021年度各大手机数码发布会合集38/134
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